Reliability & Failure Analysis
Master critical reliability engineering and failure analysis techniques through this intensive hands-on program. Develop expertise in Root Cause Analysis (RCA), Failure Mode and Effects Analysis (FMEA), and LabVIEW simulation while learning advanced testing methodologies and predictive maintenance strategies. Gain practical experience with real-world case studies, interactive workshops, and team-based projects that prepare you for immediate application in manufacturing and engineering environments.
- Available in:
- Malaysia

Corporate Pricing
Pax:
Training Provider Pricing
Pax:
Features
Classification
Focus Area Course
- Addresses skill gaps across industries
- Emphasizes emerging technologies and practices
- Enhances workforce capabilities
- Verified by industry experts
- Broadly applicable across sectors
Subsidies

What you'll learn
- Execute Failure Mode and Effects Analysis (FMEA) processes including Design FMEA (D-FMEA) and Process FMEA (P-FMEA) with severity, occurrence, and detection assessments
- Utilize advanced failure analysis techniques including Scanning Electron Microscopy (SEM), X-ray inspection, and Automated Optical Inspection (AOI)
- Apply fundamental reliability engineering concepts including Mean Time Between Failures (MTBF), failure rates, and availability calculations in manufacturing environments
- Design and implement predictive maintenance systems using vibration, thermal, and acoustic sensors with trend monitoring capabilities
- Create comprehensive control plans linked to FMEA outputs and integrate Design for Reliability (DfR) principles into product development processes
- Develop and implement LabVIEW Virtual Instruments (VI) for failure simulation, real-time monitoring, and data acquisition integration
- Conduct comprehensive Root Cause Analysis (RCA) and Business Failure Analysis (BFA) using logic trees, fishbone diagrams, and fault tree methodologies
Why should you attend?
This comprehensive training program provides participants with essential skills in reliability engineering and failure analysis methodologies. The course begins with fundamental concepts including Mean Time Between Failures (MTBF), Mean Time To Failure (MTTF), failure rates, and availability metrics, while distinguishing between reliability and quality principles. Participants explore various failure types in manufacturing environments, focusing on Printed Circuit Board (PCB) assembly issues such as solder fatigue and trace burnout, along with Surface Mount Technology (SMT), box-build, and connector failures across mechanical, electrical, and thermal categories. The program emphasizes practical Root Cause Analysis (RCA) and Business Failure Analysis (BFA) techniques through interactive activities and case simulations. Participants master logic tree construction, fishbone diagrams, and fault tree analysis while engaging in hands-on workshops. The course integrates LabVIEW software training for failure simulation and monitoring, enabling participants to create Virtual Instruments (VI) for thermal overstress detection and real-time system monitoring with data acquisition integration. Advanced topics include Failure Mode and Effects Analysis (FMEA) methodologies, distinguishing between Design FMEA (D-FMEA) and Process FMEA (P-FMEA), along with severity, occurrence, and detection assessments. The program covers reliability testing techniques including Highly Accelerated Life Testing (HALT), burn-in procedures, and Environmental Stress Screening (ESS) applications. Participants learn failure analysis techniques using Scanning Electron Microscopy (SEM), X-ray inspection, In-Circuit Testing (ICT), and Automated Optical Inspection (AOI). The course culminates with team-based projects integrating all learned concepts, followed by presentations and peer evaluations to reinforce practical application of reliability engineering principles.
Course Syllabus
Day 1 - Reliability Fundamentals & Analysis
Short Break
15 minsShort Break
15 minsRecap and Q&A
15 minsLunch
1 hourShort Break
15 minsShort Break
15 minsShort Break
15 minsRecap and Q&A
15 minsEnd of Day 1
Day 2 - Testing & LabVIEW Basics
Short Break
15 minsShort Break
15 minsRecap and Q&A
15 minsLunch
1 hourShort Break
15 minsShort Break
15 minsShort Break
15 minsRecap and Q&A
15 minsEnd of Day 2
Day 3 - FMEA & Predictive Maintenance
Short Break
15 minsShort Break
15 minsRecap and Q&A
15 minsLunch
1 hourShort Break
15 minsShort Break
15 minsShort Break
15 minsRecap and Q&A
15 minsEnd of Day 3
Day 4 - Advanced Systems & Projects
Short Break
15 minsShort Break
15 minsRecap and Q&A
15 minsLunch
1 hourShort Break
15 minsShort Break
15 minsShort Break
15 minsRecap and Q&A
15 minsEnd of Day 4
Minimum Qualification
Target Audience
Methodologies
FAQs
- Public pricing: applies for individuals signing up from different companies.
- Corporate pricing: applies if a company wants to have an intake for its employees only.
- Training provider pricing: applies only for other training providers looking to hire our trainers and use our content. Our content has a licensing fee.
Why should you attend?
This comprehensive training program provides participants with essential skills in reliability engineering and failure analysis methodologies. The course begins with fundamental concepts including Mean Time Between Failures (MTBF), Mean Time To Failure (MTTF), failure rates, and availability metrics, while distinguishing between reliability and quality principles. Participants explore various failure types in manufacturing environments, focusing on Printed Circuit Board (PCB) assembly issues such as solder fatigue and trace burnout, along with Surface Mount Technology (SMT), box-build, and connector failures across mechanical, electrical, and thermal categories. The program emphasizes practical Root Cause Analysis (RCA) and Business Failure Analysis (BFA) techniques through interactive activities and case simulations. Participants master logic tree construction, fishbone diagrams, and fault tree analysis while engaging in hands-on workshops. The course integrates LabVIEW software training for failure simulation and monitoring, enabling participants to create Virtual Instruments (VI) for thermal overstress detection and real-time system monitoring with data acquisition integration. Advanced topics include Failure Mode and Effects Analysis (FMEA) methodologies, distinguishing between Design FMEA (D-FMEA) and Process FMEA (P-FMEA), along with severity, occurrence, and detection assessments. The program covers reliability testing techniques including Highly Accelerated Life Testing (HALT), burn-in procedures, and Environmental Stress Screening (ESS) applications. Participants learn failure analysis techniques using Scanning Electron Microscopy (SEM), X-ray inspection, In-Circuit Testing (ICT), and Automated Optical Inspection (AOI). The course culminates with team-based projects integrating all learned concepts, followed by presentations and peer evaluations to reinforce practical application of reliability engineering principles.
What you'll learn
- Execute Failure Mode and Effects Analysis (FMEA) processes including Design FMEA (D-FMEA) and Process FMEA (P-FMEA) with severity, occurrence, and detection assessments
- Utilize advanced failure analysis techniques including Scanning Electron Microscopy (SEM), X-ray inspection, and Automated Optical Inspection (AOI)
- Apply fundamental reliability engineering concepts including Mean Time Between Failures (MTBF), failure rates, and availability calculations in manufacturing environments
- Design and implement predictive maintenance systems using vibration, thermal, and acoustic sensors with trend monitoring capabilities
- Create comprehensive control plans linked to FMEA outputs and integrate Design for Reliability (DfR) principles into product development processes
- Develop and implement LabVIEW Virtual Instruments (VI) for failure simulation, real-time monitoring, and data acquisition integration
- Conduct comprehensive Root Cause Analysis (RCA) and Business Failure Analysis (BFA) using logic trees, fishbone diagrams, and fault tree methodologies
Course Syllabus
Day 1 - Reliability Fundamentals & Analysis
Short Break
15 minsShort Break
15 minsRecap and Q&A
15 minsLunch
1 hourShort Break
15 minsShort Break
15 minsShort Break
15 minsRecap and Q&A
15 minsEnd of Day 1
Day 2 - Testing & LabVIEW Basics
Short Break
15 minsShort Break
15 minsRecap and Q&A
15 minsLunch
1 hourShort Break
15 minsShort Break
15 minsShort Break
15 minsRecap and Q&A
15 minsEnd of Day 2
Day 3 - FMEA & Predictive Maintenance
Short Break
15 minsShort Break
15 minsRecap and Q&A
15 minsLunch
1 hourShort Break
15 minsShort Break
15 minsShort Break
15 minsRecap and Q&A
15 minsEnd of Day 3
Day 4 - Advanced Systems & Projects
Short Break
15 minsShort Break
15 minsRecap and Q&A
15 minsLunch
1 hourShort Break
15 minsShort Break
15 minsShort Break
15 minsRecap and Q&A
15 minsEnd of Day 4
Corporate Pricing
Pax:
Training Provider Pricing
Pax:
Features
Classification
Focus Area Course
- Addresses skill gaps across industries
- Emphasizes emerging technologies and practices
- Enhances workforce capabilities
- Verified by industry experts
- Broadly applicable across sectors
Subsidies

Minimum Qualification
Target Audience
Methodologies
FAQs
- Public pricing: applies for individuals signing up from different companies.
- Corporate pricing: applies if a company wants to have an intake for its employees only.
- Training provider pricing: applies only for other training providers looking to hire our trainers and use our content. Our content has a licensing fee.
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